Patent Assignment
Reel/Frame 039809/0781
Assignment of Assignor's Interest
Recorded: 2016-09-21
Pages: 5
Assignor
ABM CO., INC.
Executed: 2016-09-07
Assignee
POINT ENGINEERING CO., LTD.
89, ASAN VALLEY-RO, DUNPO-MYEON, CHUNGCHEONGNAM-DO, ASAN-SI, 31409, KOREA, REPUBLIC OF
Covered Property
(1)
Chip Substrate Comprising a Groove Portion and Chip Package Using the Chip Substrate
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.