Patent Assignment
Reel/Frame 036149/0882
Assignment of Assignor's Interest
Recorded: 2015-07-22
Pages: 3
Assignor
TANIGAWA, TATSUYA
Executed: 2015-07-16
Assignee
AISIN SEIKI KABUSHIKI KAISHA
1, ASAHI-MACHI 2-CHOME, KARIYA-SHI, AICHI-KEN, 448-8650, JAPAN
Covered Property
(1)
Manufacturing Method of Substrate, Cutting Method of Processing Object and Laser Processing Apparatus