Patent Assignment
Reel/Frame 036306/0026
Assignment of Assignor's Interest
Recorded: 2015-08-12
Pages: 3
Assignor
SUZUKI, TOMOHIRO
Executed: 2015-08-11
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI,, NAGANO, 381-2287, JAPAN
Covered Property
(1)
Wiring Substrate and Method for Manufacturing Wiring Substrate