Patent Assignment
Reel/Frame 036406/0810
Assignment of Assignor's Interest
Recorded: 2015-08-25
Pages: 4
Assignors
YU, CHEN-HUA
Executed: 2015-08-17
YEH, SUNG-FENG
Executed: 2015-08-17
CHEN, MING-FA
Executed: 2015-08-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Three-Dimensional Integrated Circuit Structure and Bonded Structure