Patent Assignment
Reel/Frame 036449/0386
Assignment of Assignor's Interest
Recorded: 2015-08-28
Pages: 3
Assignors
NAITO, TAKASHI
Executed: 2015-07-21
TACHIZONO, SHINICHI
Executed: 2015-07-21
YOSHIMURA, KEI
Executed: 2015-07-21
HASHIBA, YUJI
Executed: 2015-07-21
ONODERA, TAIGO
Executed: 2015-07-21
AOYAGI, TAKUYA
Executed: 2015-07-21
MIYAKE, TATSUYA
Executed: 2015-07-21
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Lead-Free Low-Melting Glass Composition, Low-Temperature Sealing Glass Frit, Low-Temperature Sealing Glass Paste, Conductive Material, and Conductive Glass Paste Containing Glass Composition, and Glass-Sealed Component and Electric/Electronic Component Prepared Using the Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →