Patent Assignment
Reel/Frame 036450/0508
Assignment of Assignor's Interest
Recorded: 2015-08-28
Pages: 3
Assignors
LEE, YONG JIK
Executed: 2015-08-04
SUNG, JUNG KYUNG
Executed: 2015-08-04
KOO, BONG WAN
Executed: 2015-08-04
LIM, HYUN DUCK
Executed: 2015-08-04
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
(MAETAN-DONG) 150, MAEYOUNG-RO, YEONGTONG-GU, GYEONGGI-DO 443-743, SUWON-SI, KOREA, REPUBLIC OF
Covered Property
(1)
Printed Circuit Board and Method of Manufacturing the Same