Patent Assignment
Reel/Frame 036477/0004
Corrective Assignment to Add the Second Assignee's Data Previously Recorded at Reel: 029373 Frame: 0610. Assignor(S) Hereby Confirms the Assignment.
Recorded: 2015-08-25
Pages: 4
Assignor
OKAWA, NAOKI
Executed: 2012-11-16
Assignees
SONY CORPORATION
1-7-1 KONAN, MINATO-KU, TOKYO, JAPAN
SONY DADC CORPORATION
1-12 KITASHINAGAWA 5-CHOME, SHINAGAWA-KU, TOKYO, 141-0001, JAPAN
Covered Property
(1)
Fusing Method of Substrate Layer, Manufacturing Method of Microfluidic Chip and Fusing Apparatus of Substrate Layer
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 29, 2012
From: OKAWA, NAOKI
To: SONY CORPORATION
Reel/Frame 029373/0610 →
Assignment of Assignor's Interest
Dec 19, 2012
From: SUZUKI, YUKIE
To: SONY CORPORATION; SONY DADC CORPORATION
Reel/Frame 029502/0354 →
Assignment of Assignor's Interest
Mar 21, 2018
From: SONY DADC JAPAN INC.
To: SONY CORPORATION
Reel/Frame 045300/0459 →
Assignment of Assignor's Interest
Mar 21, 2018
From: SONY CORPORATION
To: SONY DADC BIOSCIENCES GMBH
Reel/Frame 045667/0699 →
Change of Name
Mar 21, 2018
From: SONY DADC BIOSCIENCES GMBH
To: STRATEC CONSUMABLES GMBH
Reel/Frame 045667/0796 →