Patent Assignment
Reel/Frame 045300/0459
Assignment of Assignor's Interest
Recorded: 2018-03-21
Pages: 3
Assignor
SONY DADC JAPAN INC.
Executed: 2015-05-31
Assignee
SONY CORPORATION
1-7-1 KONAN, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Fusing Method of Substrate Layer, Manufacturing Method of Microfluidic Chip and Fusing Apparatus of Substrate Layer
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 29, 2012
From: OKAWA, NAOKI
To: SONY CORPORATION
Reel/Frame 029373/0610 →
Assignment of Assignor's Interest
Dec 19, 2012
From: SUZUKI, YUKIE
To: SONY CORPORATION; SONY DADC CORPORATION
Reel/Frame 029502/0354 →
Corrective Assignment to Add the Second Assignee's Data Previously Recorded at Reel: 029373 Frame: 0610. Assignor(S) Hereby Confirms the Assignment.
Aug 25, 2015
From: OKAWA, NAOKI
To: SONY CORPORATION; SONY DADC CORPORATION
Reel/Frame 036477/0004 →
Assignment of Assignor's Interest
Mar 21, 2018
From: SONY CORPORATION
To: SONY DADC BIOSCIENCES GMBH
Reel/Frame 045667/0699 →
Change of Name
Mar 21, 2018
From: SONY DADC BIOSCIENCES GMBH
To: STRATEC CONSUMABLES GMBH
Reel/Frame 045667/0796 →