Patent Assignment
Reel/Frame 036483/0188
Assignment of Assignor's Interest
Recorded: 2015-09-02
Pages: 5
Assignors
GE, YOU
Executed: 2014-12-24
LYE, MENG KONG
Executed: 2014-12-24
WANG, ZHIJIE
Executed: 2014-12-24
Assignee
FREESCALE SEMICONDUCTOR,INC.
6501 WILLIAM CANNON DRIVE WEST, AUSTIN, TEXAS, 78735
Covered Property
(1)
Semiconductor Device with Heat-Dissipating Lead Frame
Patent:
9,355,945 →
Application:
14/843,967 →
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement to the Security Agreement
Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
Change of Name
Nov 8, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 040632/0001 →
Corrective Assignment to Correct the Nature of Conveyance Previously Recorded at Reel: 040632 Frame: 0001. Assignor(S) Hereby Confirms the Merger and Change of Name.
Sep 21, 2017
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 044209/0047 →
Release of Security Interest
Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
Assignment of Assignor's Interest
Sep 10, 2024
From: NXP USA, INC.
To: CHIP PACKAGING TECHNOLOGIES, LLC
Reel/Frame 068541/0903 →