Patent Assignment
Reel/Frame 036493/0907
Assignment of Assignor's Interest
Recorded: 2015-09-04
Pages: 5
Assignors
PENG, WEN PIN
Executed: 2015-09-03
CHI, MIN-HWA
Executed: 2015-09-02
DERDERIAN, GARO JACQUES
Executed: 2015-09-03
Assignee
GLOBALFOUNDRIES INC.
MAPLES CORPORATE SERVICES LIMITED, PO BOX 309, UGLAND HOUSE, GRAND CAYMAN, KY1-1104, CAYMAN ISLANDS
Covered Property
(1)
Methods of Forming Reduced Thickness Spacers in Cmos Based Integrated Circuit Products
Patent:
9,385,124 →
Application:
14/845,499 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.