IP Library › Assignment 036530/0739
Patent Assignment
Reel/Frame 036530/0739

Assignment of Assignor's Interest

Recorded: 2015-09-10 Pages: 4
Assignors
CHANG, CHIA-LUN
Executed: 2015-08-28
LIU, CHUNG-SHI
Executed: 2015-08-31
LIN, HSIU-JEN
Executed: 2015-08-28
CHEN, HSIEN-WEI CHEN
Executed: 2015-08-31
CHENG, MING-DA CHENG
Executed: 2015-08-28
CHEN, WEI-YU
Executed: 2015-08-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
Methods of Forming Connector Pad Structures, Interconnect Structures, and Structures Thereof
Patent: 9,570,410 →
Application: 14/815,584 →
Publication: US 2017/0033065
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the 4TH & 5TH Inventor's Name from "Hsien-Wei Chen Chen" to Hsien-Wei Chen & "Ming-Da Cheng Cheng" to "Ming-Da Cheng" Previously Recorded at Reel: 036530 Frame: 0739. Assignor(S) Hereby Confirms the Assignment. Aug 12, 2020
From: CHANG, CHIA-LUN; LIU, CHUNG-SHI; LIN, HSIU-JEN; CHEN, HSIEN-WEI
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 053468/0643 →