Methods of forming connector pad structures, interconnect structures, and structures thereof
Methods of forming connector pad structures, interconnect structures, and structures thereof are disclosed. In some embodiments, a method of forming a connector pad structure includes forming an underball metallization (UBM) pad, and increasing a surface roughness of the UBM pad by exposing the UBM pad to a plasma treatment. A polymer material is formed over a first portion of the UBM pad, leaving a second portion of the UBM pad exposed.
1. A method of forming a connector pad structure, the method comprising:
forming an underball metallization (UBM) pad;
increasing a surface roughness of the UBM pad by exposing the UBM pad to a plasma treatment; and
forming a polymer material over a first portion of the UBM pad, leaving a second portion of the UBM pad exposed.
2. The method according to claim 1 , wherein the first portion comprises an edge region of the UBM pad.
3. The method according to claim 1 , wherein the second portion comprises a central region of the UBM pad.
4. The method according to claim 1 , wherein forming the polymer material comprises forming a material selected from the group consisting essentially of: polybenzoxazole (PBO), polyimide (PI), epoxy, benzocyclobutene (BCB), molding compound, and a combination thereof.
5. The method according to claim 1 wherein forming the UBM pad comprises forming copper or a copper alloy.
6. A method of forming an interconnect structure, the method comprising:
forming a redistribution layer (RDL);
forming an underball metallization (UBM) pad over a portion of the RDL, a top surface of the UBM pad comprising a first surface roughness;
altering the first surface roughness of the top surface of the UBM pad to a second surface roughness, the second surface roughness being greater than the first surface roughness;
forming a polymer material over a first portion of the UBM pad;
forming a connector over a second portion of the UBM pad; and
reflowing a material of the connector.
7. The method according to claim 6 , wherein reflowing the material of the connector comprises forming an intermetallic compound (IMC) between the connector and the second portion of the UBM pad.
8. The method according to claim 7 , wherein forming the IMC comprises forming an IMC having a thickness of 0.5 μm to 2 μm.
9. The method according to claim 7 , wherein reflowing the material of the connector does not comprise forming the IMC between the first portion of the UBM pad and the polymer material.
10. The method according to claim 6 , wherein altering the first surface roughness comprises exposing the UBM pad to a plasma treatment.
11. The method according to claim 6 , wherein the second surface roughness has an average surface roughness (R a ) of 0.18 μm to 0.25 μm.
12. The method according to claim 6 , wherein the first surface roughness has an average surface roughness (R a ) of less than 0.18 μm.
13. The method according to claim 6 , wherein forming the connector comprises placing a stencil proximate the UBM pad, brushing on the material of the connector, and removing the stencil.
14. A method of forming an interconnect structure, the method comprising:
forming a contact pad having a surface roughness at a top surface;
altering the surface roughness of a first portion of the contact pad to increase the surface roughness;
covering the first portion of the contact pad with a polymer material;
forming a connector over a second portion of the contact pad not covered by the polymer material; and
reflowing a material of the connector.
15. The method of claim 14 , covering the first portion of the contact pad includes over the contact pad a polymer material selected from the group consisting of: polybenzoxazole (PBO), polyimide (PI), epoxy, benzocyclobutene (BCB), molding compound, and a combination thereof.
16. The method of claim 14 , wherein altering the surface roughness comprises exposing the first portion of the contact pad to a plasma treatment.
17. The method according to claim 14 , wherein altering the surface roughness comprises increasing the surface roughness to an average surface roughness (R a ) of 0.18 μm to 0.25 μm.
18. The method according to claim 14 , wherein the first portion of the contact pad has an average surface roughness (R a ) of less than 0.18 μm before the step of altering the surface roughness.
19. The method according to claim 14 , wherein forming the connector comprises placing a stencil proximate the contact pad, brushing on the material of the connector, and removing the stencil.
20. The method according to claim 14 , wherein the first portion of the contact pad is an outer periphery of the contact pad.