IP Library › Assignment 053468/0643
Patent Assignment
Reel/Frame 053468/0643

Corrective Assignment to Correct the 4TH & 5TH Inventor's Name from "Hsien-Wei Chen Chen" to Hsien-Wei Chen & "Ming-Da Cheng Cheng" to "Ming-Da Cheng" Previously Recorded at Reel: 036530 Frame: 0739. Assignor(S) Hereby Confirms the Assignment.

Recorded: 2020-08-12 Pages: 5
Assignors
CHANG, CHIA-LUN
Executed: 2015-08-28
LIU, CHUNG-SHI
Executed: 2015-08-31
LIN, HSIU-JEN
Executed: 2015-08-28
CHEN, HSIEN-WEI
Executed: 2015-08-31
CHENG, MING-DA
Executed: 2015-08-28
CHEN, WEI-YU
Executed: 2015-08-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6 HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Methods of Forming Connector Pad Structures, Interconnect Structures, and Structures Thereof
Patent: 9,570,410 →
Application: 14/815,584 →
Publication: US 2017/0033065
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 10, 2015
From: CHANG, CHIA-LUN; LIU, CHUNG-SHI; LIN, HSIU-JEN; CHEN, HSIEN-WEI CHEN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
Reel/Frame 036530/0739 →