Patent Assignment
Reel/Frame 036587/0386
Assignment of Assignor's Interest
Recorded: 2015-09-17
Pages: 4
Assignors
CHEN, HSIEN-WEI
Executed: 2015-06-01
YU, CHEN-HUA
Executed: 2015-06-01
WU, CHI-HSI
Executed: 2015-06-01
YEH, DER-CHYANG
Executed: 2015-06-01
SU, AN-JHIH
Executed: 2015-06-01
CHEN, WEI-YU
Executed: 2015-05-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Integrated Circuit Package Pad and Methods of Forming