IP Library › Assignment 036627/0713
Patent Assignment
Reel/Frame 036627/0713

Assignment of Assignor's Interest

Recorded: 2015-09-23 Pages: 5
Assignor
CHOU, SHIH-WEN
Executed: 2015-08-19
Assignees
CHIPMOS TECHNOLOGIES INC.
NO. 1, R&D 1ST RD., SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, TAIWAN
CHIPMOS TECHNOLOGIES (BERMUDA) LTD.
CANON'S COURT , 22 VICTORIA STREET ,, HAMILTON, HM12, BERMUDA
Covered Property (1)
Multi-Chip Package Structure, Wafer Level Chip Package Structure and Manufacturing Process Thereof
Patent: 9,728,479 →
Application: 14/856,546 →
Publication: US 2016/0315028
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Jun 1, 2017
From: CHIPMOS TECHNOLOGIES INC.; CHIPMOS TECHNOLOGIES (BERMUDA) LTD.
To: CHIPMOS TECHNOLOGIES INC.
Reel/Frame 042644/0892 →