IP Library › Assignment 042644/0892
Patent Assignment
Reel/Frame 042644/0892

Merger

Recorded: 2017-06-01 Pages: 2
Assignors
CHIPMOS TECHNOLOGIES INC.
Executed: 2016-11-23
Assignee
CHIPMOS TECHNOLOGIES INC.
NO. 1, R&D 1ST RD., SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, TAIWAN
Covered Property (1)
Multi-Chip Package Structure, Wafer Level Chip Package Structure and Manufacturing Process Thereof
Patent: 9,728,479 →
Application: 14/856,546 →
Publication: US 2016/0315028
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 23, 2015
From: CHOU, SHIH-WEN
To: CHIPMOS TECHNOLOGIES INC.; CHIPMOS TECHNOLOGIES (BERMUDA) LTD.
Reel/Frame 036627/0713 →