Patent Assignment
Reel/Frame 036657/0606
Assignment of Assignor's Interest
Recorded: 2015-09-25
Pages: 6
Assignors
SAITO, MUTSUKO
Executed: 2012-01-05
SAKAI, MAKOTO
Executed: 2012-01-20
MORINAGA, TOSHIYUKI
Executed: 2012-01-10
HAYASHI, SHINJIRO
Executed: 2012-01-05
Assignee
ROHM AND HAAS ELECTRONIC MATERIALS K.K.
TENNOZ CENTRAL TOWER 2-2-24 HIGASHI SHINAGAWA, SHINAGAWAKU, TOKYO, JAPAN
Covered Property
(1)
Copper Electroplating Solution and Method of Copper Electroplating
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 25, 2015
From: ROHM AND HAAS ELECTRONIC MATERIALS K.K.
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC
Reel/Frame 036657/0705 →
Change of Name
Oct 29, 2024
From: ROHM & HAAS ELECTRONIC MATERIALS LLC
To: DUPONT ELECTRONIC MATERIALS INTERNATIONAL, LLC
Reel/Frame 069272/0383 →
Security Interest
Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
Security Interest
Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →