IP Library › Assignment 036673/0751
Patent Assignment
Reel/Frame 036673/0751

Assignment of Assignor's Interest

Recorded: 2015-09-28 Pages: 3
Assignors
CHIU, CHIEN-CHIA
Executed: 2015-08-05
CHIU, MING-YEN
Executed: 2015-08-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTORING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
Post-Passivation Interconnect Structure and Methods Thereof
Patent: 9,818,711 →
Application: 14/755,889 →
Publication: US 2017/0005054
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Name of the Assignee Previously Recorded on Reel 036673 Frame 0751. Assignor(S) Hereby Confirms the Assignment. Mar 7, 2016
From: CHIU, CHIEN-CHIA; CHIU, MING-YEN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 038018/0986 →