IP Library › Assignment 038018/0986
Patent Assignment
Reel/Frame 038018/0986

Corrective Assignment to Correct the Name of the Assignee Previously Recorded on Reel 036673 Frame 0751. Assignor(S) Hereby Confirms the Assignment.

Recorded: 2016-03-07 Pages: 5
Assignors
CHIU, CHIEN-CHIA
Executed: 2015-08-05
CHIU, MING-YEN
Executed: 2015-08-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
Post-Passivation Interconnect Structure and Methods Thereof
Patent: 9,818,711 →
Application: 14/755,889 →
Publication: US 2017/0005054
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 28, 2015
From: CHIU, CHIEN-CHIA; CHIU, MING-YEN
To: TAIWAN SEMICONDUCTOR MANUFACTORING COMPANY, LTD.
Reel/Frame 036673/0751 →