Patent Assignment
Reel/Frame 036683/0257
Assignment of Assignor's Interest
Recorded: 2015-09-29
Pages: 5
Assignors
LIU, YUN
Executed: 2015-04-11
TEYSSEYRE, JEROME
Executed: 2015-05-12
JIN, YONGGANG
Executed: 2015-04-15
Assignee
STMICROELECTRONICS PTE LTD
28 ANG MO KIO INDUSTRIAL PARK 2, SINGAPORE, 569508, SINGAPORE
Covered Property
(1)
Semiconductor Packages with Pillar and Bump Structures
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.