Patent Assignment
Reel/Frame 036745/0679
Assignment of Assignor's Interest
Recorded: 2015-10-02
Pages: 4
Assignor
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Executed: 2015-10-02
Assignee
HEWLETT-PACKARD COMPANY
3000 HANOVER STREET, PALO ALTO, CALIFORNIA, 94304
Covered Properties
(10)
Scalable Wide-Array Inkjet Printhead and Method for Fabricating Same
Patent:
6,123,410 →
Application:
08/959,376 →
Inkjet Printing Apparatus with Ink Manifold
Patent:
6,250,738 →
Application:
09/216,601 →
Multilayered Platform for Multiple Printhead Dies
Patent:
6,322,206 →
Application:
09/216,606 →
Compact High-Performance,High-Density Ink Jet Printhead
Patent:
6,585,352 →
Application:
09/640,283 →
Substrate with Fluidic Channel and Method of Manufacturing
Multilayered Platform Including Electrical Interconnection for Multiple Printhead Dies
Fluid Interconnect for Printhead Assembly
Fluid Manifold for Printhead Assembly
Vent Chamber
Fluid-Ejection Device Connector
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 15, 2001
From: MILLIGAN, DONALD J.; KOCH, TIM R.; TRUNINGER, MARTHA A.; LAI, DIANE W.
To: HEWLETT-PACKARD COMPANY
Reel/Frame 012271/0683 →
Assignment of Assignor's Interest
Feb 5, 2002
From: DODD, SIMON
To: HEWLETT-PACKARD COMPANY
Reel/Frame 012368/0843 →
Assignment of Assignor's Interest
Sep 22, 2004
From: THERIEN, PATRICK J.; OLSEN, DAVID N.; GONZALES, CURT G.; MILLER, STEVEN N.
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 015831/0781 →
Assignment of Assignor's Interest
Dec 15, 2004
From: THERIEN, PATRICK J.
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 016106/0998 →
Assignment of Assignor's Interest
Jan 11, 2005
From: HEWLETT-PACKARD COMPANY
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 015583/0106 →
Assignment of Assignor's Interest
Sep 22, 2011
From: HEWLETT-PACKARD COMPANY
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 026945/0699 →