Patent Assignment
Reel/Frame 036818/0067
Assignment of Assignor's Interest
Recorded: 2015-10-19
Pages: 3
Assignee
CSMC TECHNOLOGIES FAB1 CO., LTD.
NO. 8 XINZHOU ROAD, WUXI NEW DISTRICT, JIANGSU 214028, CHINA
Covered Property
(1)
Method for Wafer Etching in Deep Silicon Trench Etching Process
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.