Method for wafer etching in deep silicon trench etching process
A method for wafer etching in a deep silicon trench etching process includes the following steps: a. electrostatically absorbing a wafer using an electrostatic chuck, and stabilizing the atmosphere required by the process (S 110 ); b. performing the sub-steps of a main process for the wafer, and the time for the sub-steps of the main process being shorter than the time required by the wafer main process; c. releasing the electrostatic adsorption of the electrostatic chuck on the wafer; d. determining whether the cumulative time of the sub-steps of the main process reaches a predetermined threshold or not, if so, performing the step e (S 150 ), and if not, repeating the operations in the steps a to c (S 140 ); and e. ending a wafer manufacturing process. The etching method avoids the wafer from continuous contact with the electrostatic chuck, reduces electrostatic accumulation on the surface of the wafer, and therefore solves the problem of resist reticulation on the surface of the wafer in the DSIE process.
1. A method of etching a wafer in a deep silicon trench etching process, comprising:
a) absorbing a wafer electrostatically by using an electrostatic chuck;
b) performing etching sub steps of a wafer main process, a time of performing the etching sub steps of the main process being shorter than a required time of the wafer main process;
c) after step b, releasing the electrostatic adsorption of the electrostatic chuck to the wafer;
d) after step c, determining whether a cumulative time of the etching sub steps of the main process reaches a threshold value, upon a determination that the threshold value has been reached the method continues to step e; and upon a determination that the cumulative time is less than the threshold value the method continues by repeating step a to step c; and
e) connecting the wafer to a ground to release static charges and ending a wafer manufacturing process.
2. The method according to claim 1 , wherein the threshold value in step d is a required time of the wafer main process.
3. The method according to claim 1 , wherein operations of step a to step c are repeated at least twice.
4. The method according to claim 1 , wherein a time of the etching sub step of the main process is less than 30 minutes.
5. The method according to claim 1 , wherein a time of releasing static charge ranges from 1 to 2 minutes.
6. The method according to claim 1 , wherein a helium flow is used to cool the wafer in the sub step of the main process.
7. The method according to claim 6 , wherein the helium flow is used to cool a back side of the wafer.
8. The method according to claim 6 , wherein a pressure of the helium flow is 1.5 mbar.
9. The method according to claim 1 , wherein the main process is etching.
10. The method according to claim 9 , wherein the etching is using a plasma etching gas to etch the wafer with formed mask.
11. The method according to claim 1 , wherein after step e, the method further comprises a step of transferring the wafer.