IP Library › Assignment 036826/0397
Patent Assignment
Reel/Frame 036826/0397

Assignment of Assignor's Interest

Recorded: 2015-10-19 Pages: 7
Assignors
WANG, ZHIJIE
Executed: 2015-03-20
BAI, ZHIGANG
Executed: 2015-03-20
GE, YOU
Executed: 2015-03-20
LYE, MENG KONG
Executed: 2015-03-20
Assignee
FREESCALE SEMICONDUCTOR,INC.
6501 WILLIAM CANNON DRIVE WEST, AUSTIN, TEXAS, 78735
Covered Property (1)
Lead Frame with Deflecting Tie Bar for Ic Package
Patent: 9,449,901 →
Application: 14/887,304 →
Publication: US 2016/0293526
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement to the Security Agreement Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
Change of Name Nov 8, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 040632/0001 →
Corrective Assignment to Correct the Nature of Conveyance Previously Recorded at Reel: 040632 Frame: 0001. Assignor(S) Hereby Confirms the Merger and Change of Name. Sep 21, 2017
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 044209/0047 →
Release of Security Interest Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
Assignment of Assignor's Interest Sep 10, 2024
From: NXP USA, INC.
To: CHIP PACKAGING TECHNOLOGIES, LLC
Reel/Frame 068541/0903 →