Patent Assignment
Reel/Frame 036835/0361
Assignment of Assignor's Interest
Recorded: 2015-10-20
Pages: 3
Assignors
LU, CHEN-FA
Executed: 2015-10-12
TSAI, CHENG-YUAN
Executed: 2015-10-12
HSU, CHING-CHUNG
Executed: 2015-10-13
CHANG, CHUNG-LONG
Executed: 2015-10-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Structure with Ultra Thick Metal and Manufacturing Method Thereof