IP Library › Assignment 036836/0502
Patent Assignment
Reel/Frame 036836/0502

Assignment of Assignor's Interest

Recorded: 2015-10-20 Pages: 7
Assignors
WEI, ANDY CHIH-HUNG
Executed: 2014-03-03
CHOI, DAE-HAN
Executed: 2014-03-03
YANG, DAE GEUN
Executed: 2014-03-03
HU, XIANG
Executed: 2014-03-03
HARIHARAPUTHIRAN, MARIAPPAN
Executed: 2014-03-03
Assignee
GLOBALFOUNDRIES INC.
P. O. BOX 309, UGLAND HOUSE, GRAND CAYMAN, KY1-1104, CAYMAN ISLANDS
Covered Property (1)
Semiconductor Structure Having Gap Fill Dielectric Layer Disposed Between Fins
Patent: 9,735,154 →
Application: 14/918,012 →
Publication: US 2016/0043081
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 2, 2019
From: GLOBALFOUNDRIES INC.
To: ALSEPHINA INNOVATIONS INC.
Reel/Frame 049669/0749 →
Release of Security Interest Nov 20, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES INC.
Reel/Frame 054636/0001 →