Patent Assignment
Reel/Frame 036854/0614
Assignment of Assignor's Interest
Recorded: 2015-10-22
Pages: 5
Assignors
MOMOI, HAJIME
Executed: 2015-09-09
MORIOKA, SATORU
Executed: 2015-09-10
ONO, TOSHIYUKI
Executed: 2015-09-16
ARAI, HIDETA
Executed: 2015-09-11
FUKUCHI, RYO
Executed: 2015-09-11
MIKI, ATSUSHI
Executed: 2015-09-11
Assignee
JX NIPPON MINING & METALS CORPORATION
6-3, OTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, 1008164, JAPAN
Covered Property
(1)
Copper Heat Dissipation Material, Carrier-Attached Copper Foil, Connector, Terminal, Laminate, Shield Material, Printed-Wiring Board, Metal Processed Member, Electronic Device and Method for Manufacturing the Printed Wiring Board
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.