IP Library Assignment 036891/0057
Patent Assignment
Reel/Frame 036891/0057

Assignment of Assignor's Interest

Recorded: 2015-10-27 Pages: 4
Assignor
NXP B.V.
Executed: 2013-06-28
Assignee
SAMSUNG ELECTRONICS CO., LTD.
SAMSUNG MAIN BUILDING, 250, TAEPYUNG-RO, 2-KA CHUNG-KU, SEOUL, KOREA, REPUBLIC OF
Covered Properties (9)
Optimized Cpu-Memory High Bandwidth Multibus Structure Simultaneously Supporting Design Reusable Blocks
Patent: 6,377,581 →
Application: 09/079,990 →
Universal Pointer Implementation Scheme for Uniformly Addressing Distinct Memory Spaces in a Processor's Address Space
Patent: 6,658,553 →
Application: 09/548,987 →
Data Processing Apparatus with Non-Volatile Memory for Both Program and Data
Patent: 6,629,241 →
Application: 09/639,152 →
Communication Device for Rapidly and Simultaneously Writing Onto a Plurality of Data Carriers, and Data Carrier for Such a Communication Device
Patent: 6,564,296 →
Application: 09/811,642 →
Publication: US 2001/0049775
Reset Arrangement for a Microcontroller
Patent: 6,978,362 →
Application: 10/135,351 →
Publication: US 2002/0166044
Controller and a Method for Controlling the Communication Between a Processor and an External Peripheral Device
Patent: 8,099,533 →
Application: 11/573,194 →
Publication: US 2011/0099304
Processing System and Method for Executing Instructions
Patent: 8,069,335 →
Application: 12/093,643 →
Publication: US 2008/0256334
Multi-Processor Circuit with Shared Memory Banks
Patent: 8,074,031 →
Application: 12/158,316 →
Publication: US 2008/0301354
Electronic Circuit with a Memory Matrix That Stores Pages Including Extra Data
Patent: 7,913,110 →
Application: 12/281,983 →
Publication: US 2009/0070637
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest May 14, 1998
From: ANAND, VISHAL; RHODEN, DESI
To: VLSI TECHNOLOGY, INC.
Reel/Frame 009176/0933 →
Assignment of Assignor's Interest Jul 26, 2000
From: DING, ZHIMIN; GOODHUE, GREGORY K.; KHAN, ATA R.
To: PHILIPE ELECTRONICS NORTH AMERICA
Reel/Frame 011001/0963 →
Assignment of Assignor's Interest Oct 24, 2000
From: RIEZEBOS, DIRK JAN
To: U.S. PHILIPS CORPORATION
Reel/Frame 011255/0881 →
Assignment of Assignor's Interest Jun 18, 2001
From: RECHBERGER, ROBERT; POSCH, STEFAN
To: U.S. PHILIPS CORPORATION
Reel/Frame 011909/0317 →
Assignment of Assignor's Interest Jul 9, 2002
From: MUTH, MATTHIAS
To: KONINKLIJKE PHILIPS ELECTRONICS N.V.
Reel/Frame 013064/0346 →
Assignment of Assignor's Interest Mar 24, 2003
From: U.S. PHILIPS CORPORATION
To: KONINKLIJKE PHILIPS ELECTRONICS N.V.
Reel/Frame 013873/0712 →
Assignment of Assignor's Interest Aug 11, 2003
From: U.S. PHILIPS CORPORATION
To: KONINKLIJKE PHILIPS ELECTRONICS N.V.
Reel/Frame 014377/0657 →
Assignment of Assignor's Interest Oct 2, 2003
From: PHILIPS ELECTRONICS NORTH AMERICA CORP.
To: KONINKLIJKE PHILIPS ELECTRONICS N.V.
Reel/Frame 014023/0456 →
Assignment of Assignor's Interest Dec 15, 2006
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: NXP B.V.
Reel/Frame 018635/0787 →
Assignment of Assignor's Interest Dec 15, 2006
From: PHILIPS SEMICONDUCTORS INC.
To: NXP B.V.
Reel/Frame 018645/0779 →
Change of Name Dec 15, 2006
From: VLSI TECHNOLOGY, INC.
To: PHILIPS SEMICONDUCTORS VLSI INC.
Reel/Frame 018635/0570 →
Change of Name Dec 22, 2006
From: PHILIPS SEMICONDUCTORS VLSI INC.
To: PHILIPS SEMICONDUCTORS INC.
Reel/Frame 018668/0255 →
Assignment of Assignor's Interest Aug 17, 2007
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: NXP B.V.
Reel/Frame 019719/0843 →
Assignment of Assignor's Interest May 14, 2008
From: KIEVITS, PETER; SMEETS, JEAN-PAUL CHARLES FRANCOIS HUBERT
To: NXP B.V.
Reel/Frame 020945/0414 →
Assignment of Assignor's Interest Jun 19, 2008
From: BEKOOIJ, MARCO JAN GERRIT
To: NXP B.V.
Reel/Frame 021123/0560 →
Assignment of Assignor's Interest Sep 6, 2008
From: VAN ACHT, VICTOR M.G.; LAMBERT, NICOLAAS
To: NXP, B.V.
Reel/Frame 021491/0608 →
Assignment of Assignor's Interest Dec 14, 2011
From: NG, CHEE YU; KABRA, NITIN SATISHCHANDRA
To: NXP B.V.
Reel/Frame 027378/0830 →
Corrective Assignment to Correct the Execution Date for the Second Inventor's Signature Previously Recorded on Reel 021491 Frame 0608. Assignor(S) Hereby Confirms the Execution Date for the Second Inventor's Signature Is 8/10/2007. Sep 13, 2012
From: VAN ACHT, VICTOR M.G.; LAMBERT, NICOLAAS
To: NXP B.V.
Reel/Frame 028953/0263 →
Security Agreement Supplement Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
Corrective Assignment to Correct the Remove Application 12092129 Previously Recorded on Reel 038017 Frame 0058. Assignor(S) Hereby Confirms the Security Agreement Supplement. Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
Patent Release Aug 17, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 039707/0471 →
Corrective Assignment to Correct the Remove Application 12681366 Previously Recorded on Reel 039361 Frame 0212. Assignor(S) Hereby Confirms the Security Agreement Supplement. May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
Corrective Assignment to Correct the Remove Application 12681366 Previously Recorded on Reel 038017 Frame 0058. Assignor(S) Hereby Confirms the Security Agreement Supplement. May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
Release of Security Interest Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
Corrective Assignment to Correct the Remove Application 12298143 Previously Recorded on Reel 042985 Frame 0001. Assignor(S) Hereby Confirms the Security Agreement Supplement. Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →