Patent Assignment
Reel/Frame 036908/0061
Assignment of Assignor's Interest
Recorded: 2015-10-29
Pages: 5
Assignee
MEDIATEK INC.
NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, TAIWAN
Covered Property
(1)
Packaging Substrate with Block-Type via and Semiconductor Packages Having the Same