Patent Assignment
Reel/Frame 036940/0141
Assignment of Assignor's Interest
Recorded: 2015-11-02
Pages: 7
Assignors
AHN, HEUI GYUN
Executed: 2015-10-29
AHN, SANG WOOK
Executed: 2015-10-21
LEE, YONG WOON
Executed: 2015-10-26
JUNG, HUY CHAN
Executed: 2015-10-21
LEE, DO YOUNG
Executed: 2015-10-22
Assignee
SILICONFILE TECHNOLOGIES INC.
(SK-U TOWER, JEONGJA-DONG) 16F, 343 BEON-GIL, 9, SEONGNAM-DAERO BUNDANG-GU, SEONGNAM-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Manufacturing Through-Hole Silicon Via
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.