Patent Assignment
Reel/Frame 036945/0637
Assignment of Assignor's Interest
Recorded: 2015-11-03
Pages: 6
Assignors
GLOEDEN, MARKUS
Executed: 2015-09-30
GENTH, HERKO
Executed: 2015-09-24
DAMBROWSKY, NINA
Executed: 2015-09-21
MCNELLY, ANTHONY
Executed: 2015-09-18
RUETHER, ROBERT
Executed: 2015-10-26
Assignee
ATOTECH DEUTSCHLAND GMBH
ERASMUSSTRASSE 20, BERLIN, 10553, GERMANY
Covered Property
(1)
Method for Depositing Thick Copper Layers Onto Sintered Materials
Application:
14/888,762 →
Publication:
US 2016/0060781
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Feb 1, 2017
From: ATOTECH DEUTSCHLAND GMBH; ATOTECH USA INC
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 041590/0001 →
Release of Security Interest
Mar 18, 2021
From: BARCLAYS BANK PLC, AS COLLATERAL AGENT
To: ATOTECH DEUTSCHLAND GMBH; ATOTECH USA, LLC
Reel/Frame 055653/0714 →