IP Library › Assignment 036972/0382
Patent Assignment
Reel/Frame 036972/0382

Assignment of Assignor's Interest

Recorded: 2015-11-05 Pages: 8
Assignors
LAMBERT, DAMIEN
Executed: 2015-03-25
SPANN, JOHN
Executed: 2015-03-03
KRASULICK, STEPHEN
Executed: 2015-03-30
Assignee
SKORPIOS TECHNOLOGIES, INC.
5600 EUBANK BOULEVARD NE, SUITE 200, ALBUQUERQUE, NEW MEXICO, 87111
Covered Property (1)
Semiconductor Bonding with Compliant Resin and Utilizing Hydrogen Implantation for Transfer-Wafer Removal
Patent: 9,991,149 →
Application: 14/933,694 →
Publication: US 2016/0133496
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Oct 23, 2017
From: SKORPIOS TECHNOLOGIES, INC.
To: PACIFIC WESTERN BANK
Reel/Frame 043926/0762 →
Release of Security Interest Nov 22, 2017
From: PACIFIC WESTERN BANK
To: SKORPIOS TECHNOLOGIES, INC.
Reel/Frame 044751/0469 →