IP Library Assignment 036975/0280
Patent Assignment
Reel/Frame 036975/0280

Assignment of Assignor's Interest

Recorded: 2015-11-06 Pages: 3
Assignors
ANNAPRAGADA, RAO
Executed: 2015-07-23
WANG, YU-JEN
Executed: 2015-07-23
SHEN, DONGNA
Executed: 2015-08-20
Assignee
HEADWAY TECHNOLOGIES, INC.
678 SOUTH HILLVIEW DRIVE, MILPITAS, CALIFORNIA, 95035
Covered Property (1)
Method to Minimize MTJ Sidewall Damage and Bottom Electrode Redeposition Using IBE Trimming
Patent: 9,660,177 →
Application: 14/848,378 →
Publication: US 2017/0069834
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 25, 2019
From: HEADWAY TECHNOLOGIES, INC.
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 048692/0917 →