Patent Assignment
Reel/Frame 037048/0745
Assignment of Assignor's Interest
Recorded: 2015-11-16
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Structure and Formation Method for Chip Package
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.