Patent Assignment
Reel/Frame 037051/0882
Assignment of Assignor's Interest
Recorded: 2015-11-16
Pages: 7
Assignors
AHN, HEUI GYUN
Executed: 2015-11-16
AHN, SANG WOOK
Executed: 2015-11-09
LEE, YONG WOON
Executed: 2015-11-11
JUNG, HUY CHAN
Executed: 2015-11-09
JUN, SUNG CHUN
Executed: 2015-11-09
Assignee
SILICONFILE TECHNOLOGIES INC.
20F, 42, HWANGSAEWUL-RO 360BEON-GIL, BUNDANG-GU SEONGNAM-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Having Improved Heat-Dissipation Characteristics
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.