Patent Assignment
Reel/Frame 041023/0187
Assignment of Assignor's Interest
Recorded: 2017-01-20
Pages: 4
Assignor
SILICONFILE TECHNOLOGIES INC.
Executed: 2016-12-22
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Properties
(13)
Separation Type Unit Pixel of Image Sensor Having Three-Dimensional Structure
Phase Difference Detection Pixel Using Microlens
Application:
14/474,550 →
Publication:
US 2015/0062390
Image Sensor Using Backside Illumination Photodiode and Method for Manufacturing the Same
Semiconductor Device Having Improved Heat-Dissipation Characteristics
Method for Correcting Color Using Rgb Data
Backlight Image Sensor Chip Having Improved Chip Driving Performance
Image Sensor Having Improved Spectral Characteristics
Application:
15/029,572 →
Publication:
US 2017/0237911
Substrate Separation-Type Three-Dimensional Chip Stacking Image Sensor and Method for Manufacturing Same
Application:
15/036,480 →
Publication:
US 2016/0300875
Device for Removing Noise on Image Using Cross-Kernel Type Median Filter and Method Therefor
4-Color Image Sensor and Method for Fabricating the Same
Application:
15/079,835 →
Publication:
US 2016/0284747
Image Data Output Device for Image Signal Processor
Image Processing Package and Camera Module Having Same
4-Color Pixel Image Sensor Having Visible Color Noise Reduction Function in Near Infrared Ray Pixel
Related Assignments
(14)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 2, 2014
From: KIM, HO SOO; KIM, JONG PHIL
To: SILICONFILE TECHNOLOGIES INC.
Reel/Frame 033650/0267 →
Assignment of Assignor's Interest
Oct 31, 2014
From: PARK, JAE YOUNG; LEE, YOUNG HA
To: SILICONFILE TECHNOLOGIES INC.
Reel/Frame 034083/0316 →
Assignment of Assignor's Interest
Mar 24, 2015
From: EOM, JAE WON
To: SILICONFILE TECHNOLOGIES INC.
Reel/Frame 035307/0091 →
Assignment of Assignor's Interest
Apr 9, 2015
From: WON, JUN HO; LEE, DO YOUNG
To: SILICONFILE TECHNOLOGIES INC.
Reel/Frame 035367/0908 →
Assignment of Assignor's Interest
Nov 16, 2015
From: AHN, HEUI GYUN; AHN, SANG WOOK; LEE, YONG WOON; JUNG, HUY CHAN
To: SILICONFILE TECHNOLOGIES INC.
Reel/Frame 037051/0882 →
Assignment of Assignor's Interest
Dec 21, 2015
From: KIM, KWANG EUN
To: SILICONFILE TECHNOLOGIES INC.
Reel/Frame 037354/0947 →
Assignment of Assignor's Interest
Feb 16, 2016
From: PARK, KYOUNG-SIK; AHN, HEUI GYUN; KO, MIN-SUK; CHO, GAB-HWAN
To: SILICONFILE TECHNOLOGIES INC.
Reel/Frame 037745/0554 →
Assignment of Assignor's Interest
Feb 29, 2016
From: LEE, BO RA; SHIN, DU SU
To: SILICONFILE TECHNOLOGIES INC.
Reel/Frame 037853/0856 →
Assignment of Assignor's Interest
Mar 24, 2016
From: PARK, JAE YOUNG; LEE, WON HO
To: SILICONFILE TECHNOLOGIES INC.
Reel/Frame 038093/0992 →
Assignment of Assignor's Interest
Apr 14, 2016
From: WON, JUN-HO
To: SILICONFILE TECHNOLOGIES INC.
Reel/Frame 038439/0042 →
Assignment of Assignor's Interest
Apr 21, 2016
From: PARK, JAE YOUNG; LEE, WON HO
To: SILICONFILE TECHNOLOGIES INC.
Reel/Frame 038347/0115 →
Assignment of Assignor's Interest
May 13, 2016
From: WON, JUN HO; LEE, DO YOUNG
To: SILICONFILE TECHNOLOGIES INC.
Reel/Frame 038582/0316 →
Assignment of Assignor's Interest
May 31, 2016
From: AHN, SANG WOOK; LEE, YONG WOON; JUNG, HUY CHAN
To: SILICONFILE TECHNOLOGIES INC.
Reel/Frame 038752/0037 →
Assignment of Assignor's Interest
Jun 2, 2016
From: JUNG, HUY CHAN; AHN, SANG WOOK; LEE, YONG WOON
To: SILICONFILE TECHNOLOGIES INC.
Reel/Frame 038788/0183 →