Patent Assignment
Reel/Frame 038582/0316
Assignment of Assignor's Interest
Recorded: 2016-05-13
Pages: 3
Assignee
SILICONFILE TECHNOLOGIES INC.
16F SKU TOWER, 9, 343BEONGIL SEONGNAMDAERO, BUNDANG-GU, SEONGNAM-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Substrate Separation-Type Three-Dimensional Chip Stacking Image Sensor and Method for Manufacturing Same
Application:
15/036,480 →
Publication:
US 2016/0300875
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.