Patent Assignment
Reel/Frame 037117/0324
Assignment of Assignor's Interest
Recorded: 2015-11-23
Pages: 5
Assignors
BASKER, VEERARAGHAVAN S.
Executed: 2015-11-20
CHENG, KANGGUO
Executed: 2015-11-19
STANDAERT, THEODORUS S.
Executed: 2015-11-19
WANG, JUNLI
Executed: 2015-11-19
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Fin Pitch Scaling for High Voltage Devices and Low Voltage Devices on the Same Wafer
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Correct the Middle Initial of the Asignor Previously Recorded at Reel: 037117 Frame: 0324. Assignor(S) Hereby Confirms the Assignment.
Dec 6, 2019
From: BASKER, VEERARAGHAVAN S.; CHENG, KANGGUO; STANDAERT, THEODORUS E.; WANG, JUNLI
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 051212/0823 →
Assignment of Assignor's Interest
Jan 6, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 051489/0557 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name
Nov 21, 2025
From: TESSERA, INC.
To: TESSERA LLC
Reel/Frame 073658/0462 →
Change of Name
Nov 21, 2025
From: TESSERA LLC
To: ADEIA SEMICONDUCTOR SOLUTIONS LLC
Reel/Frame 073658/0849 →