Assignment of Assignor's Interest

Recorded: 2015-11-24 Pages: 4

Assignors

YAMADA, TAKASHI

Executed: 2015-10-21

ODA, DAIZO

Executed: 2015-10-21

OISHI, RYO

Executed: 2015-10-21

HAIBARA, TERUO

Executed: 2015-10-21

UNO, TOMOHIRO

Executed: 2015-10-29

Assignees

NIPPON MICROMETAL CORPORATION

158-1, OAZA SAYAMAGAHARA, IRUMA-SHI, SAITAMA, 3580032, JAPAN

7-16-3, GINZA, CHUO-KU, TOKYO, 1040061, JAPAN

Covered Property (1)

Bonding Wire for Semiconductor Device Use and Method of Production of Same

Patent: 9,543,266 →

Application: 14/893,789 →

Publication: US 2016/0104687

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.