IP Library › Assignment 051095/0036
Patent Assignment
Reel/Frame 051095/0036

Change of Address for Nippon Steel Chemical & Material Co., Ltd.

Recorded: 2019-11-22 Pages: 25
Assignor
Assignee
NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
13-1, NIHONBASHI 1-CHOME, CHUO-KU, TOKYO, 103-0027, JAPAN
Covered Properties (4)
Bonding Wire for Semiconductor Device Use and Method of Production of Same
Patent: 9,543,266 →
Application: 14/893,789 →
Publication: US 2016/0104687
Bonding Wire for Semiconductor Device Use and Method of Production of Same
Patent: 9,536,854 →
Application: 14/893,833 →
Publication: US 2016/0111389
Cu PILLAR CYLINDRICAL PREFORM FOR SEMICONDUCTOR CONNECTION
Application: 15/506,956 →
Publication: US 2017/0287861
Bonding Wire for Semiconductor Devices
Application: 16/067,120 →
Publication: US 2018/0374816
Related Assignments (5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 24, 2015
From: YAMADA, TAKASHI; ODA, DAIZO; OISHI, RYO; HAIBARA, TERUO
To: NIPPON MICROMETAL CORPORATION; NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
Reel/Frame 037134/0488 →
Assignment of Assignor's Interest Nov 24, 2015
From: YAMADA, TAKASHI; ODA, DAIZO; OISHI, RYO; HAIBARA, TERUO
To: NIPPON MICROMETAL CORPORATION; NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
Reel/Frame 037135/0060 →
Assignment of Assignor's Interest Mar 1, 2017
From: YAMADA, TAKASHI; ODA, DIAZO; HAIBARA, TERUO; TERASHIMA, SHINICHI
To: NIPPON MICROMETAL CORPORATION; NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
Reel/Frame 041422/0440 →
Assignment of Assignor's Interest Jun 28, 2018
From: ODA, DAIZO; OHKABE, TAKUMI; HAIBARA, TERUO; YAMADA, TAKASHI
To: NIPPON MICROMETAL CORPORATION; NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
Reel/Frame 046234/0588 →
Change of Name Feb 27, 2019
From: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
To: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Reel/Frame 049439/0277 →