Bonding wire for semiconductor device use and method of production of same
Bonding wire for semiconductor device use where both leaning failures and spring failures are suppressed by (1) in a cross-section containing the wire center and parallel to the wire longitudinal direction (wire center cross-section), there are no crystal grains with a ratio a/b of a long axis “a” and a short axis “b” of 10 or more and with an area of 15 μm 2 or more (“fiber texture”), (2) when measuring a crystal direction in the wire longitudinal direction in the wire center cross-section, the ratio of crystal direction <100> with an angle difference with respect to the wire longitudinal direction of 15° or less is, by area ratio, 50% to 90%, and (3) when measuring a crystal direction in the wire longitudinal direction at the wire surface, the ratio of crystal direction <100> with an angle difference with respect to the wire longitudinal direction of 15° or less is, by area ratio, 50% to 90%. During the drawing step, a drawing operation with a rate of reduction of area of 15.5% or more is performed at least once. The final heat treatment temperature and the pre-final heat treatment temperature are made predetermined ranges.
1. Bonding wire for semiconductor device use with an Ag content of 90 mass % or more,
wherein, in a wire center cross-section, which is a cross-section containing the wire center and parallel to the wire longitudinal direction, there are no crystal grains with a ratio a/b of a long axis “a” and a short axis “b” of 10 or more and with an area of 15 μm 2 or more,
when measuring a crystal direction in the wire longitudinal direction in said wire center cross-section, the ratio of crystal direction <100> with an angle difference with respect to said wire longitudinal direction of 15° or less is, by area ratio, 50% to 90%, and
when measuring a crystal direction in the wire longitudinal direction at the wire surface, the ratio of crystal direction <100> with an angle difference with respect to said wire longitudinal direction of 15° or less is, by area ratio, 50% to 90%.
2. The bonding wire for semiconductor device use according to claim 1 ,
wherein said bonding wire for semiconductor device use contains one or more of Pd, Cu, Au, Zn, Pt, Ge, Sn, Ti, and Ni,
when containing Pd, Cu, Au, and Zn, contains these in a total of 0.01 mass % to 8 mass %,
when containing Pt, Ge, Sn, Ti, and Ni, contains these in a total of 0.001 mass % to 1 mass %, and
has a balance of Ag and impurities.
3. The bonding wire for semiconductor device use according to claim 1 or 2 ,
wherein S contained in said impurities is 1 mass ppm or less and Cl is 0.5 mass ppm or less.
4. A method of production of bonding wire for semiconductor device use according to claim 1 or 2 , in which the method has a drawing step which performs one or more drawing operations,
has, in the drawing step, at least one drawing operation which has a rate of reduction of area of 15.5% to 30.5%, and
performs one or more operations of heat treatment in the middle of the drawing step and a final heat treatment after the end of the drawing step,
wherein the temperature of the heat treatment right before the final heat treatment is 600° C. to 800° C. and the temperature of the final heat treatment is 300° C. to less than 600° C.
5. A method of production of bonding wire for semiconductor device use according to claim 3 , in which the method has a drawing step which performs one or more drawing operations,
has, in the drawing step, at least one drawing operation which has a rate of reduction of area of 15.5% to 30.5%, and
performs one or more operations of heat treatment in the middle of the drawing step and a final heat treatment after the end of the drawing step,
wherein the temperature of the heat treatment right before the final heat treatment is 600° C. to 800° C. and the temperature of the final heat treatment is 300° C. to less than 600° C.