Patent Assignment
Reel/Frame 046234/0588
Assignment of Assignor's Interest
Recorded: 2018-06-28
Pages: 4
Assignors
ODA, DAIZO
Executed: 2018-04-23
OHKABE, TAKUMI
Executed: 2018-04-23
HAIBARA, TERUO
Executed: 2018-04-23
YAMADA, TAKASHI
Executed: 2018-04-23
OYAMADA, TETSUYA
Executed: 2018-04-25
UNO, TOMOHIRO
Executed: 2018-04-25
Assignees
NIPPON MICROMETAL CORPORATION
158-1, OAZA SAYAMAGAHARA, IRUMA-SHI, SAITAMA, 358-0032, JAPAN
NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
7-16-3, GINZA, CHUO-KU, TOKYO, 104-0061, JAPAN
Covered Property
(1)
Bonding Wire for Semiconductor Devices
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Feb 27, 2019
From: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
To: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Reel/Frame 049439/0277 →
Change of Address for Nippon Steel Chemical & Material Co., Ltd.
Nov 22, 2019
From: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
To: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Reel/Frame 051095/0036 →