IP Library Assignment 041422/0440
Patent Assignment
Reel/Frame 041422/0440

Assignment of Assignor's Interest

Recorded: 2017-03-01 Pages: 4
Assignors
YAMADA, TAKASHI
Executed: 2017-02-27
ODA, DIAZO
Executed: 2017-02-27
HAIBARA, TERUO
Executed: 2017-02-27
TERASHIMA, SHINICHI
Executed: 2017-02-10
Assignees
NIPPON MICROMETAL CORPORATION
158-1 OAZA SAYAMAGAHARA, IRUMA-SHI, SAITAMA, 358-0032, JAPAN
NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
16-3, GINZA 7-CHOME, CHUO-KU, TOKYO, 104-0061, JAPAN
Covered Property (1)
Cu PILLAR CYLINDRICAL PREFORM FOR SEMICONDUCTOR CONNECTION
Application: 15/506,956 →
Publication: US 2017/0287861
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Feb 27, 2019
From: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
To: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Reel/Frame 049439/0277 →
Change of Address for Nippon Steel Chemical & Material Co., Ltd. Nov 22, 2019
From: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
To: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Reel/Frame 051095/0036 →