IP Library › Assignment 037134/0510
Patent Assignment
Reel/Frame 037134/0510

Assignment of Assignor's Interest

Recorded: 2015-11-24 Pages: 4
Assignors
PIETAMBARAM, SRINIVAS V.
Executed: 2015-10-12
LEE`, KUO-OH
Executed: 2015-10-12
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Surface Finishes for Interconnection Pads in Microelectronic Structures
Patent: 9,947,631 →
Application: 14/882,780 →
Publication: US 2017/0110422
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Second Inventor Name Previously Recorded at Reel: 037134 Frame: 0510. Assignor(S) Hereby Confirms the Assignment. Jan 29, 2018
From: PIETAMBARAM, SRINIVAS V.; LEE, KYU-OH
To: INTEL CORPORATION
Reel/Frame 045181/0355 →
Assignment of Assignor's Interest Aug 15, 2022
From: INTEL CORPORATION
To: TAHOE RESEARCH, LTD.
Reel/Frame 061175/0176 →