Assignment of Assignor's Interest

Recorded: 2015-12-07 Pages: 3

Assignors

MA, YIYI

Executed: 2015-12-02

GOH, KIM-YONG

Executed: 2015-12-02

ZHANG, XUEREN

Executed: 2015-12-02

Assignee

STMICROELECTRONICS PTE LTD

28 ANG MO KIO, INDUSTRIAL PARK 2, SINGAPORE, 569508, SINGAPORE

Covered Property (1)

Wafer Level Chip Scale Package (Wlcsp) Having Edge Protection

Patent: 9,576,912 →

Application: 14/957,865 →

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.