IP Library › Assignment 037242/0360
Patent Assignment
Reel/Frame 037242/0360

Assignment of Assignor's Interest

Recorded: 2015-12-08 Pages: 3
Assignors
MEYERS, JOHN G.
Executed: 2015-11-23
KHALAF, BILAL
Executed: 2015-11-30
GOGINENI, SIREESHA
Executed: 2015-11-23
LONG, BRIAN J.
Executed: 2015-11-23
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Packaged Integrated Circuit Device with Cantilever Structure
Patent: 9,871,007 →
Application: 14/866,576 →
Publication: US 2017/0092602
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 17, 2025
From: INTEL CORPORATION
To: SK HYNIX NAND PRODUCT SOLUTIONS CORP. (DBA SOLIDIGM)
Reel/Frame 072905/0252 →