IP Library › Assignment 072905/0252
Patent Assignment
Reel/Frame 072905/0252

Assignment of Assignor's Interest

Recorded: 2025-09-17 Pages: 70
Assignor
INTEL CORPORATION
Executed: 2025-08-19
Assignee
SK HYNIX NAND PRODUCT SOLUTIONS CORP. (DBA SOLIDIGM)
10951 WHITE ROCK ROAD, RANCHO CORDOVA, CALIFORNIA, 95670
Covered Properties (25)
Errors and Erasures Decoding from Multiple Memory Devices
Patent: 9,680,509 →
Application: 14/671,960 →
Publication: US 2016/0283325
Adaptive Error Correction in Memory Devices
Application: 15/737,202 →
Publication: US 2018/0165152
Managing Threshold Voltage Shift in Nonvolatile Memory
Patent: 9,721,657 →
Application: 15/089,507 →
Managing Threshold Voltage Shift in Nonvolatile Memory
Application: 15/645,990 →
Publication: US 2017/0372780
Techniques for Entry to a Lower Power State for a Memory Device
Patent: 9,818,458 →
Application: 14/862,269 →
Techniques for Entry to a Lower Power State for a Memory Device
Patent: 9,916,104 →
Application: 15/344,809 →
Publication: US 2017/0115916
Technologies for Performing a Data Copy Operation on a Data Storage Device with a Power-Fail-Safe Data Structure
Application: 14/975,150 →
Publication: US 2017/0177243
Thermal Monitoring of Memory Resources
Application: 14/837,372 →
Publication: US 2017/0060202
Thermal Monitoring of Memory Resources
Application: 16/147,950 →
Publication: US 2019/0107871
Distributed Concatenated Error Correction
Patent: 9,912,355 →
Application: 14/866,506 →
Publication: US 2017/0093438
Structures for Edge-to-Edge Coupling with Flexible Circuitry
Patent: 9,515,402 →
Application: 14/866,592 →
Efficient Memory Activation at Runtime
Application: 15/755,469 →
Publication: US 2018/0190332
Efficient Memory Activation at Runtime
Application: 16/933,704 →
Publication: US 2021/0104266
Packaged Integrated Circuit Device with Cantilever Structure
Patent: 9,871,007 →
Application: 14/866,576 →
Publication: US 2017/0092602
Packaged Integrated Circuit Device with Cantilever Structure
Application: 15/870,708 →
Publication: US 2018/0138133
Microelectronic Package Debug Access Ports
Patent: 9,646,952 →
Application: 14/857,317 →
Publication: US 2017/0084573
Microelectronic Package Debug Access Ports and Methods of Fabricating the Same
Application: 15/471,942 →
Publication: US 2017/0200685
Packaged Integrated Circuit Device with Recess Structure
Application: 15/752,240 →
Publication: US 2020/0066621
Method, Apparatus and System to Interconnect Packaged Integrated Circuit Dies
Application: 15/749,760 →
Publication: US 2019/0019777
Method, Apparatus and System to Interconnect Packaged Integrated Circuit Dies
Application: 16/516,695 →
Publication: US 2019/0341372
Integrating System in Package (Sip) with Input/Output (Io) Board for Platform Miniaturization
Application: 15/777,458 →
Publication: US 2018/0331081
Integrating System in Package (Sip) with Input/Output (Io) Board for Platform Miniaturization
Application: 16/546,280 →
Publication: US 2019/0378828
Integrating System in Package (Sip) with Input/Output (Io) Board for Platform Miniaturization
Application: 17/392,189 →
Publication: US 2021/0366883
Techniques for Data storage protection and integrity checking
Application: 14/998,323 →
Publication: US 2017/0185529
Adjustable Error Protection for Stored Data
Application: 14/947,801 →
Publication: US 2017/0147429
Related Assignments (14)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 27, 2015
From: KWOK, ZION S.
To: INTEL CORPORATION
Reel/Frame 035279/0846 →
Assignment of Assignor's Interest Nov 6, 2015
From: JAYACHANDRAN, SOWMIYA; SUNDARAM, RAJESH; FABER, ROBERT
To: INTEL CORPORATION
Reel/Frame 036975/0350 →
Assignment of Assignor's Interest Nov 18, 2015
From: MOTWANI, RAVI H.
To: INTEL CORPORATION
Reel/Frame 037073/0439 →
Assignment of Assignor's Interest Nov 20, 2015
From: PON, FLORENCE R.; KHALAF, BILAL; SHOJAIE, SAEED S.
To: INTEL CORPORATION
Reel/Frame 037150/0975 →
Assignment of Assignor's Interest Dec 4, 2015
From: SUNDARAM, RAJESH; SWAMINATHAN, MUTHUKUMAR P.; RIVERS, DOYLE
To: INTEL CORPORATION
Reel/Frame 037207/0522 →
Assignment of Assignor's Interest Dec 8, 2015
From: MEYERS, JOHN G.; KHALAF, BILAL; GOGINENI, SIREESHA; LONG, BRIAN J.
To: INTEL CORPORATION
Reel/Frame 037242/0360 →
Assignment of Assignor's Interest Jan 11, 2016
From: TRIKA, SANJEEV N.; RAMALINGAM, ANAND S.
To: INTEL CORPORATION
Reel/Frame 037455/0493 →
Assignment of Assignor's Interest Jan 14, 2016
From: LI, XIANG; HALL, STEPHEN H.
To: INTEL CORPORATION
Reel/Frame 037495/0569 →
Assignment of Assignor's Interest Nov 22, 2016
From: QAWAMI, SHEKOUFEH; SUNDARAM, RAJESH; DAMLE, PRASHANT S.; RIVERS, DOYLE
To: INTEL CORPORATION
Reel/Frame 040675/0437 →
Assignment of Assignor's Interest Mar 21, 2017
From: JAYACHANDRAN, SOWMIYA; SUNDARAM, RAJESH; FABER, ROBERT
To: INTEL CORPORATION
Reel/Frame 041653/0694 →
Assignment of Assignor's Interest Jan 16, 2018
From: QAWAMI, SHEKOUFEH; SUNDARAM, RAJESH; DAMLE, PRASHANT S.; RIVERS, DOYLE
To: INTEL CORPORATION
Reel/Frame 045074/0378 →
Assignment of Assignor's Interest Sep 6, 2019
From: LIU, ZHIJUN; TANG, JIAN
To: INTEL CORPORATION
Reel/Frame 050292/0526 →
Assignment of Assignor's Interest Feb 8, 2021
From: LIU, BIN; MEYERS, JOHN G.; PON, FLORENCE R.
To: INTEL CORPORATION
Reel/Frame 055256/0402 →
Assignment of Assignor's Interest Oct 14, 2021
From: LIU, ZHIJUN; TANG, JIAN
To: INTEL CORPORATION
Reel/Frame 057794/0908 →