Method, apparatus and system to interconnect packaged integrated circuit dies
Techniques and mechanisms for interconnecting stacked integrated circuit (IC) dies. In an embodiment, a first end of a wire is coupled to a first IC die of a stack, where a second end of the wire is further anchored to the stack independent of the coupled first end. A package material is subsequently disposed around IC dies of the stack and a first portion of the wire that includes the first end. Two-point anchoring of the wire to the stack aids in providing mechanical support to resist movement that might otherwise displace and/or deform the wire while the package material is deposited. In another embodiment, the first portion of the wire is separated from the rest of the wire, and a redistribution layer is coupled to the first portion to enable interconnection between the first IC die and another IC die of the stack.
1. A device, comprising:
a stack of dies in a stair-step arrangement, the stack of dies comprising a first die over a second die, the second die over a third die;
a package material laterally adjacent to and encapsulating the stack of dies;
a redistribution layer over the package material and over the stack of dies;
a first plurality of wires coupling the first die to the redistribution layer, the first plurality of wires in the package material and having a first height, and the first plurality of wires coupled to a side of the first die facing the redistribution layer;
a second plurality of wires coupling the second die to the redistribution layer, the second plurality of wires in the package material and having a second height greater than the first height, and the second plurality of wires coupled to a side of the second die facing the redistribution layer;
a third plurality of wires coupling the third die to the redistribution layer, the third plurality of wires in the package material and having a third height greater than the second height, and the third plurality of wires coupled to a side of the third die facing the redistribution layer; and
a plurality of solder balls on the redistribution layer.
2. The device of claim 1 , wherein the package material is further beneath the stack of dies.
3. The device of claim 1 , further comprising:
a material layer between the stack of dies and the redistribution layer.
4. The device of claim 3 , wherein the material layer includes a residual adhesive or a residual dummy material.
5. The device of claim 4 , wherein the residual dummy material includes aluminum.
6. The device of claim 1 , further comprising:
a first isolation material layer between the first die and the second die; and
a second isolation material layer between the second die and the third die.
7. The device of claim 1 , wherein the package material comprises an epoxy.
8. The device of claim 1 , wherein the package material comprises a resin.
9. The device of claim 1 , wherein the package material comprises a plastic.
10. The device of claim 1 , wherein the package material comprises a ceramic.
11. A device, comprising:
a stack of three or more dies in a stair-step arrangement;
a package material laterally adjacent to and encapsulating the stack of three or more dies;
a redistribution layer over the package material and over the stack of three more dies;
a plurality of wires comprising individual wires coupling corresponding ones of the three or more dies to the redistribution layer, the plurality of wires in the package material, and the plurality of wires coupled to respective sides of the three or more dies facing the redistribution layer; and
a plurality of solder balls on the redistribution layer.
12. The device of claim 11 , wherein the package material is further beneath the stack of three or more dies.
13. The device of claim 11 , further comprising:
a material layer between the stack of three or more dies and the redistribution layer.
14. The device of claim 13 , wherein the material layer includes a residual adhesive or a residual dummy material.
15. The device of claim 14 , wherein the residual dummy material includes aluminum.
16. The device of claim 11 , further comprising:
an isolation material between adjacent dies of the stack of three or more dies.
17. The device of claim 11 , wherein the package material comprises an epoxy.
18. The device of claim 11 , wherein the package material comprises a resin.
19. The device of claim 11 , wherein the package material comprises a plastic.
20. The device of claim 11 , wherein the package material comprises a ceramic.
21. A device, comprising:
a stack of dies in a stair-step arrangement, the stack of dies comprising a first die over a second die, the second die over a third die;
a package material laterally adjacent to and encapsulating the stack of dies;
a redistribution layer over the package material and over the stack of dies;
a first plurality of wires coupling the first die to the redistribution layer, the first plurality of wires in the package material and having a first height;
a second plurality of wires coupling the second die to the redistribution layer, the second plurality of wires in the package material and having a second height greater than the first height;
a third plurality of wires coupling the third die to the redistribution layer, the third plurality of wires in the package material and having a third height greater than the second height;
a plurality of solder balls on the redistribution layer; and
a material layer between the stack of dies and the redistribution layer, wherein the material layer includes a residual adhesive or a residual dummy material, and wherein the residual dummy material includes aluminum.
22. A device, comprising:
a stack of three or more dies in a stair-step arrangement;
a package material laterally adjacent to and encapsulating the stack of three or more dies;
a redistribution layer over the package material and over the stack of three more dies;
a plurality of wires comprising individual wires coupling corresponding ones of the three or more dies to the redistribution layer, the plurality of wires in the package material;
a plurality of solder balls on the redistribution layer; and
a material layer between the stack of three or more dies and the redistribution layer, wherein the material layer includes a residual adhesive or a residual dummy material, and wherein the residual dummy material includes aluminum.