Integrating system in package (SIP) with input/output (IO) board for platform miniaturization
Methods and apparatus relating to integrating System in Package (SiP) with Input/Output (IO) board for platform miniaturization are described. In an embodiment, a SiP board includes a plurality of logic components. An IO board is coupled to the SiP board via a grid array. The plurality of logic components is provided on both sides of the SiP board and one or more of the plurality of logic components are to positioned in an opening in the IO board. Other embodiments are also disclosed and claimed.
1. An apparatus comprising:
a System in Package (SiP) board, wherein the SiP board comprises a plurality of logic components; and
an Input Output (IO) board coupled to the SiP board via a grid array,
wherein the plurality of logic components is to be provided on both a first side and a second side of the SiP board, wherein one or more of the plurality of logic components are to be positioned in an opening in the IO board, wherein the IO board comprises one or more logic components on a first side and a second side of the IO board, wherein the first side of the IO board comprises all of the one or more logic components with a lower profile and the second side of the IO board comprises all of the one or more logic components with a taller profile.
2. The apparatus of claim 1 , wherein the grid array is to comprise one or more of: land grid array, ball grid array, pin grid array, and solder grid array.
3. The apparatus of claim 1 , wherein a height of the one or more of the plurality of logic components is not to exceed beyond a surface formed by a side of the IO board that faces away from a coupling formed by the grid array.
4. The apparatus of claim 1 , wherein the first side of the IO board is to be coupled to the SiP board via the grid array.
5. The apparatus of claim 1 , wherein the first side of the SiP board is to comprise all of the plurality of logic components with a lower profile and the second side of the SiP board is to comprise all of the plurality of logic components with a taller profile.
6. The apparatus of claim 1 , wherein the first side of the SiP board comprises all of the plurality of logic components with a lower profile and the second side of the SiP board comprises all of the plurality of logic components with a taller profile, wherein the first side of the SiP board is to face the same direction as the first side of the IO board.
7. The apparatus of claim 1 , wherein the grid array is to be provided on a periphery of the SiP board.
8. The apparatus of claim 1 , wherein the SiP board is to comprise a plurality of signal pins on both sides of the SiP board.
9. The apparatus of claim 1 , wherein the SiP board is to comprise a plurality of signal pins on both sides of the SiP board, wherein at least one of the plurality of signal pins is to be provided on both sides of the SiP board.
10. The apparatus of claim 1 , further comprising one or more flex cables to electrically couple at least two of the plurality of logic components.
11. The apparatus of claim 1 , further comprising one or more flex cables to electrically couple at least one of the plurality of logic components with a logic component on the IO board.
12. The apparatus of claim 1 , further comprising one or more flex cables to electrically couple at least one of the plurality of logic components with another logic component.
13. The apparatus of claim 1 , wherein the plurality of logic components is to comprise one or more of: a Graphics Processing Unit (GPU), a Central Processing Unit (CPU), memory, power management integrated circuit, one or more inductors, a peripheral control hub, one or more integrated circuit devices, a voltage regulator, a power charger, one or more battery connectors, a wireless communication device, a serial peripheral interface, and a Bluetooth device.
14. The apparatus of claim 13 , wherein the CPU or the GPU is to comprise one or more processor cores.
15. The apparatus of claim 1 , wherein the IO board is to comprise one or more logic components selected from a group comprising: non-volatile memory, solid state drive, one or more sensors, a camera, a wireless communication device, and a Bluetooth device.
16. A method comprising:
providing a System in Package (SiP) board, wherein the SiP board comprises a plurality of logic components; and
wherein an Input Output (IO) board is coupled to the SiP board via a grid array, wherein the plurality of logic components are provided on both a first side and a second side of the SiP board, wherein one or more of the plurality of logic components are positioned in an opening in the IO board, wherein the IO board comprises one or more logic components on a first side and a second side of the IO board, wherein the first side of the IO board comprises all of the one or more logic components with a lower profile and the second side of the IO board comprises all of the one or more logic components with a taller profile.
17. The method of claim 16 , wherein the grid array comprises one or more of: land grid array, ball grid array, pin grid array, and solder grid array.
18. The method of claim 16 , wherein a height of the one or more of the plurality of logic components is not to exceed beyond a surface formed by a side of the IO board that faces away from a coupling formed by the grid array.
19. The method of claim 16 , wherein the first side of the IO board is coupled to the SiP board via the grid array.
20. An apparatus comprising:
a System in Package (SiP) board, wherein the SiP board comprises a plurality of logic components; and
an Input Output (IO) board coupled to the SiP board via a grid array,
wherein the plurality of logic components is to be provided on both a first side and a second side of the SiP board, wherein one or more of the plurality of logic components are to be positioned in an opening in the IO board, wherein the first side of the SiP board comprises all of the plurality of logic components with a lower profile and the second side of the SiP board comprises all of the plurality of logic components with a taller profile, wherein the first side of the SiP board is to face the same direction as the first side of the IO board.
21. The apparatus of claim 20 , wherein the IO board comprises one or more logic components on a first side and a second side of the IO board, wherein the first side of the IO board comprises all of the one or more logic components with a lower profile and the second side of the IO board comprises all of the one or more logic components with a taller profile.
22. The apparatus of claim 20 , wherein the grid array comprises one or more of: land grid array, ball grid array, pin grid array, and solder grid array.
23. The apparatus of claim 20 , wherein a height of the one or more of the plurality of logic components is not to exceed beyond a surface formed by a side of the IO board that faces away from a coupling formed by the grid array.
24. The apparatus of claim 20 , wherein a first side of the IO board is to be coupled to the SiP board via the grid array.
25. The apparatus of claim 20 , wherein the SiP board comprises a plurality of signal pins on both sides of the SiP board.