IP Library › Assignment 058915/0765
Patent Assignment
Reel/Frame 058915/0765

Assignment of Assignor's Interest

Recorded: 2022-02-07 Pages: 3
Assignors
GOH, ENG HUAT
Executed: 2015-12-24
HOE, WEE
Executed: 2016-01-04
YONG, KHANG CHOONG
Executed: 2015-01-04
OOI, PING PING
Executed: 2015-12-23
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Integrating System in Package (Sip) with Input/Output (Io) Board for Platform Miniaturization
Application: 15/777,458 →
Publication: US 2018/0331081
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 17, 2025
From: INTEL CORPORATION
To: SK HYNIX NAND PRODUCT SOLUTIONS CORP. (DBA SOLIDIGM)
Reel/Frame 072905/0252 →